Integrated circuit packaging - PDFSEARCH.IO - Document Search Engine

Integrated circuit packaging
Results: 80

#	Item
51	F R A U N H O F E R I n s t i t u t e F o R E l e c t roni c N A no s y s t e m s E N A S System Packaging Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 04:48:28 Electronics manufacturing Semiconductor device fabrication Wafer bonding Chemical bonding Microelectromechanical systems Reactive bonding Glass frit bonding Three-dimensional integrated circuit Micro-Opto-Electro-Mechanical Systems Microtechnology Technology Electronics
52	T&M, Wireless, Electronic Displays, ICs the news and products journal for the electronics industry www.canadianelectronics.ca ntitled-4 1 Add to Reading List Source URL: www.canadianelectronics.ca Language: English - Date: 2012-05-08 09:16:36 Microtechnology Power cables Electronic design Quad-flat no-leads package Electrical wiring Wire bonding Integrated circuit packaging Wire Reliability Semiconductor device fabrication Technology Electromagnetism
53	1 Assembly and Packaging Difficult Challenges Difficult Challenges[removed]Summary of Issues Add to Reading List Source URL: public.itrs.net Language: English - Date: 2014-03-31 09:28:23 Microtechnology Wafer Back end of line Microelectromechanical systems Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array Semiconductor device fabrication Electronics Technology
54	Microsoft PowerPoint - Chang-Chien_WLP presentation[removed]v1.ppt Add to Reading List Source URL: www.kiss.caltech.edu Language: English - Date: 2008-07-23 18:43:06 Electronic engineering Electronics manufacturing Integrated circuits Wafer-level packaging Monolithic microwave integrated circuit Semiconductors Wafer Gallium arsenide High electron mobility transistor Electronics Technology Semiconductor device fabrication
55	1 Assembly and Packaging Difficult Challenges Difficult Challenges[removed]Summary of Issues Add to Reading List Source URL: www.itrs.net Language: English - Date: 2014-03-31 09:28:23 Microtechnology Wafer Back end of line Microelectromechanical systems Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array Semiconductor device fabrication Electronics Technology
56	Microsystem Integration and Packaging 3D Integration Technology RTI International is a leader in 3D integration technology, having developed a wide range of 3D process capabilities and achieved successful demonstrations Add to Reading List Source URL: www.rti.org Language: English - Date: 2013-03-19 09:35:14 Technology Three-dimensional integrated circuit Through-silicon via Wafer Integrated circuit RTI International Microfabrication Via EV Group Semiconductor device fabrication Electronic engineering Electronics
57	3x3 advanced program ad.ai Add to Reading List Source URL: www.ectc.net Language: English - Date: 2014-03-04 21:24:48 Electronics Packaging Semiconductor devices Industrial design Electronic design Reliability IMEC Integrated circuit Microelectromechanical systems Technology Semiconductor device fabrication Electronic engineering
58	Flexible Packaging Achievement Awards 2012 Winning packages are organized in alphabetical order by award level (Highest Achievement, Gold, Silver). The information and descriptions for all packages are provided by the ma Add to Reading List Source URL: www.flexpack.org Language: English - Date: 2012-02-23 12:57:13 Semiconductor device fabrication Industrial design Packaging and labeling Retailing Bemis Company Amcor Integrated circuit packaging Dual in-line package Graphic design Technology Business Industrial engineering
59	FOR IMMEDIATE RELEASE Contact: Lauren A. Kinard Communication Manager [removed], ([removed]The Flexible Packaging Association Announces Winning Entries of the 55th Add to Reading List Source URL: www.flexpack.org Language: English - Date: 2011-03-14 17:04:41 Business Industrial engineering Industrial design Packaging and labeling Retailing Retort pouch Food packaging Integrated circuit packaging Packaging Technology Food science
60	3D Systems Packaging Research Center AN INDUSTRY-ACADEMIA CONSORTIUM Chip-Last Embedded MEMS, Actives and Passives With Chip-First Benefits Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:49:13 Microtechnology Semiconductor device fabrication Integrated circuits Three-dimensional integrated circuit Microelectromechanical systems Materials science Electromagnetism Technology

UPDATE